Industry application
Industry application
PCB
Industry pain points and challenges
Challenges and opportunities faced by PCBLong process flow and changeable bottleneck stations
Long manufacturing cycle and difficult defect/rework management
Discrete + process mixed operation, poor uniformity
Production process changes frequentlyThe pre-process is managed by PNL, and the post-process is managed by SET/PCS
Changes are frequent in the production process, and version management is difficult
Quality and stock issuesPoor chemical stability and insufficient quality consistency
WIP has a large inventory and requires lean production
We Provide
Solution Example
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